Solvent Wipe
Used for prep of surface for pad heat element bonding and click bond bonding.
Contains in minimal amounts entrapped in a wipe:
n-Heptane, 142-82-5
Acetone, 67-64-1
Methyl Cyclohexane, 108-87-2
p-Amyl Acetate, 628-63-7
See link for SDS: SDS for CB911 or Downloads tab.