TACB911

Part Number: TACB911

PRICE:

$11.00

Solvent Wipe

Description

Solvent Wipe

Used for prep of surface for pad heat element bonding and click bond bonding.

Contains in minimal amounts entrapped in a wipe:
n-Heptane, 142-82-5
Acetone, 67-64-1
Methyl Cyclohexane, 108-87-2
p-Amyl Acetate, 628-63-7

See link for SDS: SDS for CB911 or Downloads tab.

Additional Information

Conversion Notes: See instruction TN02788 and TN02782 for more information

Old Part Number: N/A CB911

USA-Cert (8130-3 available): PMA-Subcomponent (YES)

Downloads

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